Separator Plate

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  • 630 series, For most of lamination
  • Exceptional heat treatment, scratch resistant, high hardness
  • With Nickle, corrosion resistant, pin hole free

SUS 630
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  • S4 and Mp2 series, for Multi-layer and HDI board
  • High TCE close to copper, better resistance to copper wrinkling
  • Provide 0.5 mm thickness, increase product capacity

Hitec
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  • 6160 Alloy, for Adarapress
  • Superior anodized layer, high reliability
  • Anodized gap free,high performance of insulation

Anodize Plus

Specification of SUS 630

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Specification of Hitec series

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Specification of Anodize +

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