Lamination Plate

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Pin-Lam

  • For multi-layer PCB
  • Superior flatness, long life
  • High precision, reliable quality

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TSP

  • For high registration product
  • Combine with TADCO Lamination plate
  • High registration achievable

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Mass-Lam

  • For most of PCB fabrication
  • High level Hardness, wear resistant, long service life
  • Advanced heat treatment, resist warping

Specification of Tooling Plate

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TADCO Super Tooling™

TADCO's Super Tooling™ offers  extremely precise close tolerance tooling for applications requiring  extra tight control.  Bushing replacement for Super Tooling™ is done at our factory to hold  the extra tight tolerances.  Super Tooling™ is packaged with a special  hole design, then coupled with custom finished tight tolerance pin and bushings.  

Specifications

  • AISI 4140
    Standard 
  • Hardness:  36/40 Rockwell C 
  • Parallelism:  Within .001" TIR 
  • Flatness:  .0025"/ft. 
  • Hole-to-Hole Location:  Up to ±.00025" 
  • Surface Finish:  #32 RMS 
  • Thickness:  .375" ±.002" / 10mm 
  • Expansion Factor (TCE/CTE):  12.1 x 10' per C° 
  • Plate Size:  +1/16" - 0 

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TADCO Tight Tolerance™ Tooling

TADCO TT™ Tooling offers similar benefits to TADCO's  Super Tooling™, but allows for field replaceable bushings while retaining an extremely tight tolerance.  TADCO's exclusive technology precisely  controls hole to hole locations.  TT™ Tooling can use standard bushing  configurations as well as special Super Tooling-style pins and bushings.  

Specifications

  • AISI 4140
    Standard 
  • Hardness:  36/40 Rockwell C 
  • Parallelism:  Within .001" TIR 
  • Flatness:  .005"/ft. 
  • Hole-to-Hole Location:  ±.0005" 
  • Surface Finish:  #32 RMS 
  • Thickness:  .375" ±.002" / 10mm 
  • Expansion Factor (TCE/CTE):  12.1 x 10' per C° 
  • Plate Size:  +1/16" - 0 

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Lamination Tooling & Transport Plates

TADCO's strict adherence to quality standards and exclusive use of custom alloys makes a world of difference when producing tough multillayer PCB's. Every order of tooling plates comes with a Coordinates Measuring Machine Report and Certificate of Compliance traceable to MIL standards. In addition, TADCO can manufacture Lamination and Transport Plates for any press system; both manual and automatic load and unload. TADCO's spercialized knowledge of the PCB lamination processes as well as metallurgical and heat treating sciences combined with highly graded steel alloys allows us to produce the finest tooling available today.  

Specifications

  • AISI 4140
    Standard 
  • Hardness:  36/40 Rockwell C 
  • Parallelism:  Within .001" TIR 
  • Flatness:  .005"/ft. 
  • Hole-to-Hole Location:  ±.001"
  •  Surface Finish:  #32 RMS 
  • Thickness:  .375" ±.002" / 10mm 
  • Expansion Factor (TCE/CTE):  12.1 x 10' per C° 
  • Plate Size:  +1/16" - 0 

Introduction of Top Spacer Plate Concept

TADCO TSP technology

Registration in PCB lamination is the greatest factor in yield. In order to help customers achieve their registration goals and reduce waste, Tadco has introduced the NEW, patent-pending, Top Spacer Plate (TSP) system, in addition to our high registration tooling. 

What's TSP?

TADCO’s Top Spacer Plate system is a simple process; we have a patent pending aluminum plate that goes over your existing tooled top plate. Relief holes are bored into the aluminum plate allowing you to use full-length pins without the risk of them hitting the platen. Pin engagement is crucial for good registration, the better the engagement of pins, in both the top and bottom lamination plates, the higher the registration. Tadco has  devised the concept of using a Top Spacer Plate within the lamination tooling package. The added thickness of the Top Spacer Plate and the relief bore, allow full engagement of the pins on both the top and bottom lamination plates, this in turn increases the stability of all the layers within the package. This stability equates to higher registration and significantly reduces pin and bushing damage.

Why TSP?

Although adding a Top Spacer Plate to the lamination package does reduce room within the press for production, it can increase the yield rates dramatically. Through the course of testing and eventually apply this method to full-production, we have seen increases in yield as great as 40%. In many instances this increase more than offsets the decreased room for production. Also, the reduced damage to both pins and bushings, greatly decreases down time, repairs and the overhead of replacing these items.

Specification of Top & Carrier Plate

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